Infrastructure Intelligence

AI Infrastructure Supply Chain Timeline

Every time the industry clears one bottleneck, the next one surfaces. GPU compute led to memory, memory led to HBM supply, HBM led to packaging, packaging led to power. Here’s the full sequence.

8 phases·3 active bottlenecks·2 resolved·2020–2030+
2024–2026Most Severe

3. HBM Supply Shortage

Manufacturing Bottleneck

A single AI GPU needs 80GB to 200GB of HBM. Demand exploded with GPT-4 class models. Manufacturing is so complex that SK Hynix, Samsung, and Micron struggle to keep up. Prices have surged 70%–100%.

Simple Analogy

You built a Ferrari engine (GPU), but the road is a dirt path (HBM). There’s no point in building more engines if there’s nowhere to drive them.

Impact

Production delays for NVIDIA’s Blackwell. Even in early 2026, chips are sold out. Rubin (scheduled for late 2026) is already facing HBM4 supply anxiety.

Status in 2026

Still sold out. Supply is expected to ease slightly in the second half of 2026 as capacity expands.

Key Players

SK Hynix (60%+ HBM share)Samsung (HBM3E ramp)Micron (HBM3E)NVIDIA (demand driver)

The Return of the Memory Wall

We widened the road (HBM), but now the warehouse (capacity) is the issue.

PIM (Processor-In-Memory): Put small calculators inside the memory itself so the data doesn’t have to travel to the GPU for simple tasks.
CXL (Compute Express Link): Connect multiple memories like an external hard drive, enabling virtually infinite memory expansion.
Hybrid Bonding: Eliminate wires to stack HBM chips directly. Shorter paths, reduced resistance, hundreds of thousands of I/O connection points.

GreenCIO Relevance

HBM lead times directly gate data center build-out schedules. When chips slip, construction timelines slip with them.

2025–2027Felt Acutely

5. The Power Wall

Electricity, Cooling, Infrastructure

A single modern GPU pulls 700W–1000W+. Large clusters need power equivalent to a nuclear power plant. By 2026, AI data center demand could exceed 100GW.

Simple Analogy

The engine is so powerful that the gas stations (grid) can’t pump fuel fast enough. If you can’t plug it in, the chip is just a paperweight.

Impact

Construction delays for data centers and soaring electricity costs. Grid saturation in places like Northern Virginia is a major hurdle.

Status in 2026

The Power Wall is being felt acutely. Northern Virginia grid saturation is forcing hyperscalers to secondary markets. New builds face 3–5 year utility interconnection queues.

Key Players

EquinixDigital RealtyMicrosoftGoogleMetaAmazon (AWS)EatonSchneider ElectricVertiv

GreenCIO Relevance

This is GreenCIO’s core domain. We track grid capacity, interconnection queues, PPA availability, and cooling constraints across 1,247+ sites so investors know which projects will actually get built.

Investor Takeaway

The pattern is predictable: solve one constraint and capital floods into the next. If HBM4 eases the bandwidth bottleneck, the constraint shifts immediately to Power and Interconnects. The companies that own the next bottleneck own the pricing power.

Near-term (2026)

HBM supply, CoWoS packaging, Power grid capacity

Mid-term (20272028)

Optical interconnects, CPO, Data center power infrastructure

Long-term (2030+)

Miniaturization limits, Chiplets, Synthetic data, MoE architectures

Timeline framework adapted from analysis by @Tesla_Teslaway. Status assessments and company data updated for February 2026.